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VG Technologies mainly provides all kinds of double and multilayer printed circuit board in gold/silver/tin/OSP surface finishing, with gold connectors, carbon ink, heavy copper, high TG FR4 laminate material, and with complex technology: blind/buried vias (HDI), impedance control, conductive plug hole, peelable masks, BGA, countersink holes, half hole, via-in-pad, and variety of color photographic ink, provides Rogers/Nelco/Teflon laminate material PCB, high thermal conductivity MCPCB, while provides FPC manufacture service and one-stop turnkey service, widely used in home appliance, consumer electronics, automobile, medical device, aerospace, military, industrial fields.For more products information, please visit website http://www.shcircuits.com

4 Layers Half Hole PCB
Material: FR4 TG150 1.6mm
Copper thickness:  1/1/1/1 oz
Surface finishing: ENIG
Min hole size: 0.25mm,
Min trace width/space:0.2/0.2mm
8 Layers rigid PCB
Material: FR4,TG180, 1.60mm,
Copper thickness: 2/2//2/2/2//2/2/2 oz
Surface finishing: OSP
Min hole size: 0.25mm,
Min trace width/space: 0.12/0.12mm
2 Layers rigid PCB
FR4,TG170, 0.5mm,
Copper thickness: 1/1 oz
Surface finishing: HASL lead free
Min hole size: 0.5mm,
Min trace width/space:0.25/0.25mm
 
1 Layer rigid PCB
Material: FR4,TG135, 1.60mm,
Copper thickness: 1oz
Surface finishing: Immersion gold
Min hole size: 0.5mm,
Min trace width/space:0.3/0.3mm
6 Layers Gold Finger PCB
Material FR4 TG150 1.6mm
Copper thickness:  2/2/2/2/2/2 oz
Surface finishing: ENIG
Min hole size: 0.2mm,
Min trace width/space: 0.1/0.1 mm
2 Layers MCPCB
Material: Aluminum Base 1.6mm
Copper thickness:  2/2 oz
Surface finishing: ENIG
Min hole size: 1.0mm,
Min trace width/space: 0.8/0.8 mm

 

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